US 12,437,994 B2
Protective film-forming composition containing diol structure
Tokio Nishita, Toyama (JP); Yuto Hashimoto, Toyama (JP); and Yuki Endo, Toyama (JP)
Assigned to NISSAN CHEMICAL CORPORATION, Tokyo (JP)
Appl. No. 17/926,033
Filed by NISSAN CHEMICAL CORPORATION, Tokyo (JP)
PCT Filed Jun. 11, 2021, PCT No. PCT/JP2021/022277
§ 371(c)(1), (2) Date Nov. 17, 2022,
PCT Pub. No. WO2021/251481, PCT Pub. Date Dec. 16, 2021.
Claims priority of application No. 2020-102045 (JP), filed on Jun. 12, 2020.
Prior Publication US 2023/0187208 A1, Jun. 15, 2023
Int. Cl. H01L 21/027 (2006.01); C07D 303/16 (2006.01); C07D 303/27 (2006.01); H01L 21/306 (2006.01)
CPC H01L 21/0275 (2013.01) [C07D 303/16 (2013.01); C07D 303/27 (2013.01); H01L 21/30604 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A protective film-forming composition against a semiconductor wet etching solution comprising:
an organic solvent, and
a compound (A) that has in a molecule at a terminal thereof a structure having at least one pair of two hydroxy groups adjacent to each other, has a weight average molecular weight of 1,500 or less, and contains no heterocyclic ring; and
wherein the protective film-forming composition comprises particles having an average particle size of 3 nm or less as determined by a dynamic light scattering method.