| CPC H01J 37/32825 (2013.01) [B08B 3/08 (2013.01); G03F 7/2026 (2013.01); H01J 37/32449 (2013.01); H01J 37/3266 (2013.01); H01J 2237/022 (2013.01); H01J 2237/182 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3343 (2013.01)] | 14 Claims |

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1. A method for etching lithium niobate, the method comprising:
a process of etching lithium niobate using a mask pattern, as a physical dry etching method using Ar plasma produced in a chamber through Ar gas,
wherein in the process of etching lithium niobate, a process pressure of the chamber is maintained at 1 mTorr to 20 mTorr, and
a process of forming a mask pattern on the lithium niobate, wherein the forming of the mask pattern comprises:
a process of forming an adhesive film on the lithium niobate;
a process of spin-coating an HSQ resist on the adhesive film;
a process of forming a conductive layer by spin-coating a conductive layer solution on the HSQ resist:
a process of patterning the conductive layer and the HSQ resist; and
a process of developing the conductive layer and the HSQ resist.
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