US 12,437,976 B2
Substrate processing apparatus
Masato Shinada, Fuchu (JP); and Einstein Noel Abarra, Fuchu (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Nov. 13, 2024, as Appl. No. 18/945,649.
Claims priority of application No. 2023-199256 (JP), filed on Nov. 24, 2023.
Prior Publication US 2025/0174440 A1, May 29, 2025
Int. Cl. H01J 37/32 (2006.01); C23C 14/35 (2006.01); H01J 37/34 (2006.01)
CPC H01J 37/32651 (2013.01) [C23C 14/35 (2013.01); H01J 37/32522 (2013.01); H01J 37/3405 (2013.01); H01J 2237/332 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a processing container;
a temperature adjustment structure including a flow path inside a sidewall of the processing container;
a shield member installed in the processing container so as to be adjacent to the flow path;
a conductive member installed between the shield member and the sidewall in which the flow path is located;
a buffer member having conductivity and interposed between the shield member and the conductive member; and
a plurality of fixing members installed between the sidewall and the conductive member, having elasticity and conductivity, and configured to fix the conductive member so that the conductive member is pressed against the shield member.