US 12,437,973 B2
Plasma chamber with multiphase rotating independent gas cross-flow with reduced volume and dual VHF
Kenneth S. Collins, San Jose, CA (US); Michael R. Rice, Pleasanton, CA (US); James D. Carducci, Sunnyvale, CA (US); and Daisuke Shimizu, Milpitas, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 4, 2021, as Appl. No. 17/519,451.
Application 17/519,451 is a continuation in part of application No. 17/023,186, filed on Sep. 16, 2020.
Prior Publication US 2022/0084795 A1, Mar. 17, 2022
Int. Cl. H01J 37/32 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/505 (2006.01); C23C 16/52 (2006.01); H01L 21/67 (2006.01)
CPC H01J 37/32449 (2013.01) [C23C 16/4412 (2013.01); C23C 16/455 (2013.01); C23C 16/505 (2013.01); C23C 16/52 (2013.01); H01J 37/32834 (2013.01); H01L 21/67069 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/334 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A plasma treatment chamber, comprising:
one or more sidewalls;
a support surface within the one or more sidewalls to hold a workpiece;
a first gas injector along the one or more sidewalls to inject a first gas flow in a first direction generally parallel to and across a surface of the workpiece;
a first pump port along the one or more sidewalls generally opposite of the first gas injector to pump out the first gas flow, the first pump port including a first plasma screen and a first pressure control valve;
a second gas injector along the one or more sidewalls to inject a second gas flow in a second direction generally parallel to and across the surface of the workpiece, the second direction different from the first direction;
a second pump port along the one or more sidewalls generally opposite of the second gas injector to pump out the second gas flow, the second pump port including a second plasma screen and a second pressure control valve;
a third gas injector formed in an opening through the one or more sidewalls below the first plasma screen of the first pump port and over the first pressure control valve to inject a third gas flow from below the surface of the workpiece from the first pump port; and
a controller configured to control the injection of the first gas flow, the second gas flow, and the third gas flow as a process gas mixture, an independent gas injection (IGI) mixture, or both, the process gas mixture and the IGI mixture comprising one or more of an etchant gas or deposition gas, a diluent gas, an oxidizer gas, a reducing gas, and a halogen-containing gas.