US 12,437,930 B2
Ceramic electronic component, method for manufacturing the same, and circuit board
Maiko Yamane, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Jan. 30, 2023, as Appl. No. 18/161,604.
Claims priority of application No. 2022-015310 (JP), filed on Feb. 3, 2022.
Prior Publication US 2023/0245833 A1, Aug. 3, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/224 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A ceramic electronic component comprising:
a multilayer body having a substantially rectangular parallelepiped shape including a plurality of internal electrode layers and a plurality of dielectric layers alternately laminated; and
a pair of external electrodes covering each of a pair of first corner portions extending between one surface and a pair of opposing surfaces adjacent to the one surface out of four surfaces of the multilayer body excluding both end surfaces in a laminating direction of the multilayer body;
wherein the pair of first corner portions each have an arc shape projecting outward when the laminating direction of the multilayer body is viewed from front,
each of the plurality of internal electrode layers has a substantially rectangular outer edge when the laminating direction of the multilayer body is viewed from front,
each of the plurality of internal electrode layers includes an arc-shaped second corner portion exposed to one of the pair of first corner portions so as to be in contact with one of the pair of external electrodes, the arc-shaped second corner portion being positioned at one end of a side alongside the one surface of four sides forming the substantially rectangular outer edge, and
a center angle of an arc of the arc-shaped second corner portion is less than 90 degrees.