US 12,437,927 B2
Electronic device with a ceramic element and surface-mount terminals
Akihiro Masuda, Tokyo (JP); Shinya Ito, Tokyo (JP); Norihisa Ando, Tokyo (JP); Hideki Kaneko, Tokyo (JP); Ken Aburakawa, Tokyo (JP); Kenya Tamaki, Tokyo (JP); and Akitoshi Yoshii, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Jun. 8, 2023, as Appl. No. 18/331,294.
Claims priority of application No. 2022-096631 (JP), filed on Jun. 15, 2022.
Prior Publication US 2023/0411077 A1, Dec. 21, 2023
Int. Cl. H01G 4/224 (2006.01); H01G 4/228 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 4/228 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a case including a recessed portion and an opening edge portion of the recessed portion;
a ceramic element arranged in the recessed portion, having a first main surface and a second main surface facing each other, and including a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface, in which the first main surface and the second main surface are a pair of surfaces having a largest area in the ceramic element;
a first metal terminal including a first mounting portion arranged on the opening edge portion and approximately parallel to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; and
a second metal terminal including a second mounting portion arranged on the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.