US 12,437,139 B1
Isolation of compartments in a layered printed circuit board, and apparatus and methods for the same
Thomas Scott Morgan, Virginia Beach, VA (US); Martin Mayer, Bartlesville, OK (US); and Steven Yates, Charlottesville, VA (US)
Assigned to Management Services Group, Inc., Virginia Beach, VA (US)
Filed by Management Services Group, Inc., Virginia Beach, VA (US)
Filed on Mar. 4, 2024, as Appl. No. 18/594,963.
Application 18/150,509 is a division of application No. 17/530,874, filed on Nov. 19, 2021, granted, now 11,580,287, issued on Feb. 14, 2023.
Application 17/530,874 is a division of application No. 17/169,703, filed on Feb. 8, 2021, granted, now 11,210,446, issued on Dec. 28, 2021.
Application 18/594,963 is a continuation of application No. 18/150,509, filed on Jan. 5, 2023, granted, now 11,972,190.
Claims priority of provisional application 63/057,463, filed on Jul. 28, 2020.
Int. Cl. H05K 1/18 (2006.01); G06F 30/394 (2020.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); G06F 115/12 (2020.01)
CPC G06F 30/394 (2020.01) [H05K 1/0216 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/46 (2013.01); G06F 2115/12 (2020.01); H05K 2201/1006 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10613 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a printed circuit board (PCB) having a plurality of layers and including a first portion and a second portion mutually exclusive from the first portion of the PCB, the PCB includes a third portion mutually exclusive and physically separate from the first portion of the PCB and the second portion of the PCB,
a first layer from the plurality of layers having a first portion and a second portion mutually exclusive and physically separate from the first portion of the first layer, the first portion of the first layer being associated with power of the first portion of the PCB, the second portion of the first layer being a dielectric in the second portion of the PCB,
a second layer from the plurality of layers having a first portion and a second portion mutually exclusive and physically separate from the first portion of the second layer, the first portion of the second layer being a dielectric in the first portion of the PCB, the second portion of the second layer being associated with power of the second portion of the PCB,
a third layer from the plurality of layers being a dielectric in the first portion of the PCB and the second portion of the PCB, the third layer being disposed between the first layer and the second layer,
a fourth layer from the plurality of layers having a first portion, a second portion and a third portion, the first portion of the fourth layer is mutually exclusive and physically separate from the second portion of the fourth layer and the third portion of the fourth layer, the second portion of the fourth layer is mutually exclusive and physically separate from the third portion of the fourth layer,
the first portion of the fourth layer being a dielectric in the first portion of the PCB, the second portion of the fourth layer being a dielectric in the second portion of the PCB, the third portion of the fourth layer being associated with power of the third portion of the PCB; and
a power filter operatively coupled to the first portion of the PCB and the second portion of the PCB.