US 12,436,702 B2
Hybrid wear leveling for in-place data replacement media
Ying Yu Tai, Mountain View, CA (US); Jiangli Zhu, San Jose, CA (US); and Ning Chen, San Jose, CA (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Nov. 29, 2022, as Appl. No. 18/071,325.
Application 18/071,325 is a continuation of application No. 16/110,691, filed on Aug. 23, 2018, granted, now 11,537,307.
Prior Publication US 2023/0097187 A1, Mar. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0647 (2013.01) [G06F 3/0616 (2013.01); G06F 3/0659 (2013.01); G06F 3/0673 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a memory device; and
a processing device, operatively coupled with the memory device, to perform operations comprising:
periodically performing a first wear leveling operation using a direct mapping function on a data management unit of the memory device at a first frequency; and
periodically performing a second wear leveling operation using indirect mapping on groups of data management units of the memory device at a second frequency, wherein the second wear leveling operation is performed less frequently than the first wear leveling operation, and wherein periodically performing the second wear leveling operation comprises:
detecting an occurrence of a trigger corresponding to the second wear leveling operation:
identifying an available physical location of a plurality of physical locations on the memory device, wherein the available physical location is identified based on respective write counts of the plurality of physical locations on the memory device;
copying data from one of the groups of data management units to the available physical location; and
updating an entry in a look-up table, the entry corresponding to a logical index associated with the data from the one of the groups of data management units and indicating a physical index corresponding to the available physical location.