US 12,436,683 B2
Memory device with multiple plane functionalities
Xiang Yang, Santa Clara, CA (US)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Sandisk Technologies, Inc., Milpitas, CA (US)
Filed on Aug. 17, 2023, as Appl. No. 18/234,993.
Prior Publication US 2025/0060880 A1, Feb. 20, 2025
Int. Cl. G06F 13/16 (2006.01); G06F 3/06 (2006.01)
CPC G06F 3/0613 (2013.01) [G06F 3/0634 (2013.01); G06F 3/064 (2013.01); G06F 3/0679 (2013.01); G06F 13/1694 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of performing an operation in a memory device, comprising the steps of:
preparing a die that includes a plurality of memory blocks which are physically arranged in six planes, the die being configured to allow parallel operations in memory blocks of any combination of all six planes;
configuring the die to operate in at least two different operating modes depending on a type of memory product that the die is electrically connected with, the at least two operating modes including a four-plane operating mode wherein memory blocks in only four of the six planes can be selected simultaneously and a six-plane operating mode wherein memory blocks in all six planes can be selected simultaneously;
connecting the die to a memory product;
detecting whether the memory product is a first type of memory product or is a second type of memory product that is different than the first type of memory product;
in response to the memory product being detected as being the first type of memory product, then automatically setting the die into the four-plane operating mode; and
in response to the memory product being detected as being the second type of memory product, then automatically setting the die into the six-plane operating mode.