US 12,436,651 B2
Touch sensor and method for producing touch sensor
Kazuhiro Hasegawa, Kanagawa (JP); and Takahiro Ohno, Kanagawa (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Feb. 29, 2024, as Appl. No. 18/591,829.
Claims priority of application No. 2023-038291 (JP), filed on Mar. 13, 2023; and application No. 2023-112975 (JP), filed on Jul. 10, 2023.
Prior Publication US 2024/0310965 A1, Sep. 19, 2024
Int. Cl. G06F 3/044 (2006.01); G06F 3/041 (2006.01)
CPC G06F 3/0445 (2019.05) [G06F 3/04164 (2019.05); G06F 3/0448 (2019.05); G06F 2203/04112 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A touch sensor comprising:
a substrate; and
conductive layers formed on the substrate,
wherein the conductive layer has
a touch detection electrode,
a first electrode pad formed on at least one end of the touch detection electrode,
a peripheral wiring drawn out from the first electrode pad, and
a second electrode pad connected to the peripheral wiring,
the touch detection electrode, the first electrode pad, the peripheral wiring, and the second electrode pad each have a layer to be plated and a metal plating layer covering the layer to be plated,
the layer to be plated in at least one of the first electrode pad or the peripheral wiring has a gap that interrupts the layer to be plated, and
portions of the metal plating layer across the gap are electrically connected to each other by filling the gap with the metal plating layer.