US 12,436,583 B2
Electronic device including heat dissipation structure
Hyunje Cho, Suwon-si (KR); and Jiwoo Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 28, 2023, as Appl. No. 18/477,024.
Application 18/477,024 is a continuation of application No. PCT/KR2022/005091, filed on Apr. 8, 2022.
Claims priority of application No. 10-2021-0045762 (KR), filed on Apr. 8, 2021.
Prior Publication US 2024/0028092 A1, Jan. 25, 2024
Int. Cl. G06F 1/16 (2006.01); G06F 1/20 (2006.01)
CPC G06F 1/203 (2013.01) [G06F 1/1616 (2013.01); G06F 1/1656 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing comprising an opening;
a cover configured to open or close the opening; and
a link structure positioned inside the housing and connected to the cover,
wherein the link structure comprises:
an actuator configured to output power based on a temperature detected inside the housing;
a first link configured to move in a first direction by the power;
a second link configured to transmit the power in a second direction perpendicular to the first direction in response to a movement of the first link and including an elastic structure comprising a first spring and a second spring, each of the first and second springs having different elastic forces; and
a third link connected to the second link and the cover and configured to transmit the power in a third direction perpendicular to the first direction and the second direction to switch the cover from a closed state to an open state.