US 12,436,468 B2
Exposure apparatus, exposure method, device manufacturing method, and device
Yoji Watanabe, Kumagaya (JP)
Assigned to NIKON CORPORATION, Tokyo (JP)
Appl. No. 18/286,275
Filed by NIKON CORPORATION, Tokyo (JP)
PCT Filed Mar. 17, 2022, PCT No. PCT/JP2022/012296
§ 371(c)(1), (2) Date Oct. 10, 2023,
PCT Pub. No. WO2022/220010, PCT Pub. Date Oct. 20, 2022.
Claims priority of application No. 2021-067085 (JP), filed on Apr. 12, 2021.
Prior Publication US 2024/0184214 A1, Jun. 6, 2024
Int. Cl. G03F 7/00 (2006.01); G03F 9/00 (2006.01)
CPC G03F 7/70508 (2013.01) [G03F 7/70775 (2013.01); G03F 9/7088 (2013.01)] 29 Claims
OG exemplary drawing
 
1. An exposure apparatus for exposing a photosensitive layer formed as an upper layer of a draw-out electrode provided on a plurality of semiconductor chips arranged on a substrate, the exposure apparatus comprising:
a substrate stage onto which the substrate is to be mounted, the plurality of semiconductor chips being arranged on the substrate along a uniaxial direction;
an exposure unit configured to radiate an exposure light toward the draw-out electrode provided in an electrode formation area extending, on at least one of the plurality of semiconductor chips, along the uniaxial direction;
a pattern determination unit configured to determine an exposure pattern to be exposed onto the photosensitive layer by the exposure unit; and
a controller configured to control at least the substrate stage and the exposure unit, wherein:
the pattern determination unit is configured to determine, as the exposure pattern, a pattern of a relay wiring connecting the draw-out electrode and a predetermined position with respect to the substrate, by using an output from a measurement unit configured to measure a position of the plurality of semiconductor chips provided on the substrate so as to obtain a positional deviation of the plurality of semiconductor chips; and
the controller is configured to expose the pattern of the relay wiring onto an exposure area extending, on the photosensitive layer, in the uniaxial direction by the exposure unit, while moving the substrate from a first-side in the uniaxial direction to a second-side opposite to the first-side in the uniaxial direction by the substrate stage.