US 12,436,463 B2
Apparatus for treating substrate and method for treating a substrate
Min Jung Park, Cheonan-si (KR); Soo Bin Yong, Cheonan-si (KR); and Jae Hoon Park, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Jun. 12, 2023, as Appl. No. 18/333,185.
Claims priority of application No. 10-2022-0172461 (KR), filed on Dec. 12, 2022.
Prior Publication US 2024/0192602 A1, Jun. 13, 2024
Int. Cl. G03F 7/16 (2006.01); G03F 1/56 (2012.01); H01L 21/02 (2006.01); H01L 21/47 (2006.01); H01L 21/67 (2006.01)
CPC G03F 7/162 (2013.01) [G03F 1/56 (2013.01); H01L 21/02282 (2013.01); H01L 21/47 (2013.01); H01L 21/67034 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate treating method comprising:
first treating including supplying a first liquid to a rotating substrate; and
second treating including supplying a second liquid to the rotating substrate after the supplying of the first liquid,
wherein the first treating includes,
a main diffusing including main supplying the first liquid to the rotating substrate to coat a whole area of the substrate with the first liquid and to remove particles attached on the substrate,
subsequently a first drying including stopping supplying of the first liquid to the rotating the substrate, and
subsequently a supplementary diffusing including supplementary supplying the first liquid to the rotating substrate to fill a space between patterns formed on the substrate,
wherein in the main diffusing, a rotation speed of the substrate is increased during the supplying of the first liquid to the rotating substrate, and
in the first drying, the rotation speed is increased from a highest speed of the main diffusing.