US 12,436,457 B2
Developing apparatus and substrate processing apparatus
Giwoong Nam, Incheon (KR); Jin Kwak, Chungcheongnam-do (KR); Jaeseung Lee, Seoul (KR); Taekyu Choi, Incheon (KR); Inho Son, Incheon (KR); Sanghyun Park, Gyeongsangnam-do (KR); and Yeongwon Kang, Gyeonggi-do (KR)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Jun. 13, 2023, as Appl. No. 18/333,570.
Claims priority of application No. 202210684598.5 (CN), filed on Jun. 16, 2022.
Prior Publication US 2023/0408915 A1, Dec. 21, 2023
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/0025 (2013.01) 9 Claims
OG exemplary drawing
 
1. A developing apparatus, comprising:
a housing;
a wafer support disposed within the housing and for holding a wafer;
a semipermeable diaphragm disposed within the housing and separating the housing into an upper housing defining an upper chamber and a lower housing defining a low chamber, wherein the semipermeable diaphragm is semipermeable to moisture such that moisture is allowed to move from the lower chamber to the upper chamber, but liquid drops formed from the moisture are prohibited to move from the upper chamber to the lower chamber; and
a nozzle assembly disposed above the wafer support and for spraying at least developer to the wafer support;
wherein the upper housing comprises an opening, and the semipermeable diaphragm comprises an opening corresponding to the opening of the upper housing, wherein the developing apparatus further comprises:
a support arm that passes through the openings of the upper housing and the semipermeable diaphragm and for mounting the nozzle assembly.