US 12,436,456 B2
Molding apparatus, molding method, and template
Masatoshi Kobayashi, Tochigi (JP); and Keiko Chiba, Tochigi (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Aug. 27, 2021, as Appl. No. 17/459,590.
Claims priority of application No. 2020-146878 (JP), filed on Sep. 1, 2020.
Prior Publication US 2022/0066316 A1, Mar. 3, 2022
Int. Cl. G03F 7/00 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/0002 (2013.01) [H01L 21/0271 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method of molding, the method comprising:
arranging a curable composition on a substrate having an uneven surface shape;
bringing a template into contact with the curable composition; and
curing the curable composition in a state of being in contact with the template,
wherein the template includes a planar surface portion which is blank and a planarization coating layer on the planar surface portion, the planarization coating layer having a planar portion which comes into contact with the curable composition,
wherein the planar portion of the planarization coating layer has an area having a site front least squares range (SFQR), as measured by a thickness and profile measurement system, of 20 nm or less in an area of at least 26 mm*8 mm, and
wherein the template is configured to follow the uneven surface shape of the substrate when the template is brought into contact with the curable composition on the substrate.