US 12,436,428 B2
Light-emitting substrate, backlight module, and display apparatus
Jie Wang, Beijing (CN); Xintao Wu, Beijing (CN); Wenzhuo Tang, Beijing (CN); and Zouming Xu, Beijing (CN)
Assigned to HEFEI BOE RUISHENG TECHNOLOGY CO., LTD., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed by Hefei BOE Ruisheng Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed on Apr. 18, 2024, as Appl. No. 18/638,711.
Application 18/638,711 is a continuation of application No. PCT/CN2023/079652, filed on Mar. 3, 2023.
Prior Publication US 2024/0295774 A1, Sep. 5, 2024
Int. Cl. G02F 1/1335 (2006.01); G02F 1/13357 (2006.01); G09G 3/20 (2006.01); G09G 3/32 (2016.01); G09G 3/34 (2006.01); H10H 20/857 (2025.01); H10K 59/129 (2023.01); G02F 1/1362 (2006.01)
CPC G02F 1/133612 (2021.01) [G02F 1/133603 (2013.01); G02F 1/136204 (2013.01); G09G 3/2085 (2013.01); G09G 3/2088 (2013.01); G09G 3/32 (2013.01); G09G 3/3426 (2013.01); G09G 2300/0408 (2013.01); G09G 2300/0426 (2013.01); G09G 2300/0465 (2013.01); G09G 2310/0275 (2013.01); H05K 2201/10106 (2013.01); H10H 20/857 (2025.01); H10K 59/129 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A light-emitting substrate having a functional area and a bonding area spaced apart in a first direction; the light-emitting substrate comprising:
a substrate;
a plurality of driver chips located on the substrate and located in the functional area, wherein the plurality of driver chips include a plurality of first driver chips and a plurality of second driver chips; among the plurality of first driver chips, at least one first driver chip is located on at least one side of the plurality of second driver chips in the first direction; a first driver chip of the plurality of first driver chips includes at least one dummy pin;
a plurality of conductive patterns located between the substrate and the plurality of driver chips, wherein a conductive pattern of the plurality of conductive patterns is electrically connected to a dummy pin; and
a plurality of light-emitting device groups located on the substrate, wherein
the first driver chip further includes a plurality of channel pins, a channel pin is electrically connected to a light-emitting device group; and
among the plurality of channel pins of the first driver chip, a part of the channel pins serves as the dummy pin and is connected to no light-emitting device group.