US 12,436,413 B2
Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (MRR) in open cavity photonic integrated chips (OCPIC)
Chia-Pin Chiu, Tempe, AZ (US); Kaveh Hosseini, Livermore, CA (US); Omkar Karhade, Chandler, AZ (US); and Tim Tri Hoang, San Jose, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 31, 2022, as Appl. No. 17/710,703.
Prior Publication US 2023/0314849 A1, Oct. 5, 2023
Int. Cl. G02F 1/01 (2006.01); G02B 6/293 (2006.01)
CPC G02F 1/0147 (2013.01) [G02B 6/29395 (2013.01); G02B 6/2934 (2013.01); G02F 2203/15 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optoelectronic system, comprising:
a first substrate;
a second substrate over the first substrate;
a micro-ring resonator (MRR) over the second substrate;
a heater integrated into the MRR;
a cladding over the MRR;
an opening through the first substrate and the second substrate to expose a bottom surface of the MRR; and
a base spanning across the opening.