US 12,436,361 B2
Projection exposure apparatus for semiconductor lithography
Joachim Hartjes, Aalen (DE); Alexander Wolf, Essingen (DE); and Toralf Gruner, Aalen-Hofen (DE)
Assigned to Carl Zeiss SMT GmbH, Oberkochen (DE)
Filed by Carl Zeiss SMT GmbH, Oberkochen (DE)
Filed on Jun. 6, 2022, as Appl. No. 17/805,558.
Application 17/805,558 is a continuation of application No. PCT/EP2020/083370, filed on Nov. 25, 2020.
Claims priority of application No. 102019219231.9 (DE), filed on Dec. 10, 2019.
Prior Publication US 2022/0299733 A1, Sep. 22, 2022
Int. Cl. G02B 7/195 (2021.01); G02B 7/18 (2021.01); G03F 7/00 (2006.01)
CPC G02B 7/195 (2013.01) [G02B 7/1815 (2013.01); G03F 7/70891 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a mirror comprising a cutout;
a temperature-regulating body in the cutout of the mirror; and
a sensor configured to detect a distance between the temperature-regulating body and an inner surface of the cutout,
wherein:
the temperature-regulating body comprises a cavity configured to allow a fluid to flow therethrough to regulate a temperature of the temperature-regulating body;
the temperature-regulating body does not contact the cutout of the mirror; and
the apparatus is a semiconductor lithography projection exposure apparatus.