US 12,436,354 B2
Optical module and method of manufacturing optical module
Kensaku Shimada, Osaka (JP); Takeshi Inoue, Osaka (JP); Taisuke Nagasaki, Osaka (JP); and Toshihisa Yokochi, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Filed by SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Filed on Jul. 12, 2023, as Appl. No. 18/221,178.
Claims priority of application No. 2022-124893 (JP), filed on Aug. 4, 2022.
Prior Publication US 2024/0045166 A1, Feb. 8, 2024
Int. Cl. G02B 6/42 (2006.01); B32B 15/04 (2006.01); G02B 1/14 (2015.01); G02B 7/00 (2021.01); G02B 27/00 (2006.01)
CPC G02B 7/003 (2013.01) [B32B 15/043 (2013.01); G02B 1/14 (2015.01); G02B 27/0012 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An optical module comprising:
an optical component;
a substrate including a main surface, the substrate mounting the optical component thereon;
a mount portion provided on the main surface of the substrate, the mount portion being configured to mount the optical component thereon; and
at least one measurement reference portion provided on the main surface of the substrate at a position apart from the mount portion, the measurement reference portion including a reference point that becomes a height reference when measuring a mount height of the optical component.