US 12,436,346 B2
Optically bridged multicomponent package with extended temperature range
Philip Winterbottom, San Jose, CA (US); David Lazovsky, Los Gatos, CA (US); Ankur Aggarwal, Pleasanton, CA (US); Martinus Bos, San Jose, CA (US); and Subal Sahni, La Jolla, CA (US)
Assigned to Celestial AI Inc., Santa Clara, CA (US)
Filed by Celestial AI Inc., Santa Clara, CA (US)
Filed on Apr. 4, 2025, as Appl. No. 19/170,397.
Application 19/170,397 is a division of application No. 18/742,028, filed on Jun. 13, 2024, granted, now 12,298,608.
Application 18/742,028 is a division of application No. 18/243,474, filed on Sep. 7, 2023, granted, now 12,124,095, issued on Oct. 22, 2024.
Application 18/243,474 is a continuation of application No. 18/123,083, filed on Mar. 17, 2023, granted, now 11,835,777, issued on Dec. 5, 2023.
Application 19/170,397 is a continuation of application No. 19/070,348, filed on Mar. 4, 2025.
Application 19/070,348 is a continuation of application No. 17/903,455, filed on Sep. 6, 2022, granted, now 12,271,595, issued on Apr. 8, 2025.
Claims priority of provisional application 63/448,585, filed on Feb. 27, 2023.
Claims priority of provisional application 63/420,330, filed on Oct. 28, 2022.
Claims priority of provisional application 63/321,453, filed on Mar. 18, 2022.
Prior Publication US 2025/0231429 A1, Jul. 17, 2025
Int. Cl. G02F 1/01 (2006.01); G01K 7/02 (2021.01); G01K 7/14 (2006.01); G02B 6/42 (2006.01); G02F 1/015 (2006.01)
CPC G02F 1/0123 (2013.01) [G01K 7/023 (2013.01); G01K 7/028 (2013.01); G01K 7/14 (2013.01); G02B 6/4245 (2013.01); G02B 6/4246 (2013.01); G02B 6/428 (2013.01); G02B 6/4295 (2013.01); G02F 1/0113 (2021.01); G02F 1/0157 (2021.01)] 21 Claims
OG exemplary drawing
 
1. A bridging apparatus for optically joining a first die and a second die, comprising:
a bridge having first and second interconnect regions for electrical interconnection to the first and second dies respectively;
a first photonic path in the bridge from the first interconnect region to the second interconnect region;
a second photonic path in the bridge from the second interconnect region to the first interconnect region; and
a first portion of a photonic transceiver coupled with the first interconnect region to send a first optical signal via the first photonic path and receive a second optical signal via the second photonic path;
wherein:
the first portion of the photonic transceiver resides in a photonic integrated circuit (PIC) and a second portion of the photonic transceiver resides in an electric integrated circuit (EIC), the first and the second portions being coupled via an electrical interconnect less than 2 mm in length, and wherein:
the first portion of the photonic transceiver comprises a modulator or photodetector, and the second portion of the photonic transceiver comprises a serializer or deserializer.