US 12,436,338 B2
Hitless optical power monitor
Geza Kurczveil, Goleta, CA (US); and Raymond G. Beausoleil, Seattle, WA (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed on Mar. 2, 2023, as Appl. No. 18/116,696.
Prior Publication US 2024/0295695 A1, Sep. 5, 2024
Int. Cl. G02B 6/136 (2006.01); G02B 6/122 (2006.01); G02B 6/12 (2006.01)
CPC G02B 6/136 (2013.01) [G02B 6/122 (2013.01); G02B 2006/12097 (2013.01); G02B 2006/12173 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for fabricating a photonic integrated circuit (PIC) with an embedded optical power monitor, the method comprising:
creating a photomask based on a design of the PIC, wherein the photomask comprises a pattern defining an optical waveguide for embedding the optical power monitor, and wherein creating the photomask comprises introducing a predetermined level of roughness along at least one edge of the pattern defining the optical waveguide; and
fabricating the PIC, which comprises using the photomask to create the optical waveguide with the introduced roughness on a sidewall corresponding to the edge of the pattern, thereby allowing light absorbed by the roughness to create free carriers for detection by the optical power monitor.