US 12,436,314 B2
Technologies for chip-to-chip optical data transfer background
Khaled Ahmed, San Jose, CA (US); Pooya Tadayon, Portland, OR (US); Joshua B. Fryman, Corvallis, OR (US); and Sergey Yuryevich Shumarayev, Los Altos Hills, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 23, 2021, as Appl. No. 17/561,366.
Prior Publication US 2023/0204819 A1, Jun. 29, 2023
Int. Cl. H04B 10/00 (2013.01); G02B 1/00 (2006.01); H01L 25/16 (2023.01); H04B 10/50 (2013.01); G02B 5/04 (2006.01); G02B 5/08 (2006.01)
CPC G02B 1/002 (2013.01) [H01L 25/167 (2013.01); H04B 10/502 (2013.01); G02B 5/04 (2013.01); G02B 5/08 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A system comprising:
a first integrated circuit chip;
one or more microLEDs mounted on the first integrated circuit chip;
a second integrated circuit chip;
one or more microphotodiodes mounted on the second integrated circuit chip; and
a substrate,
wherein individual microLEDs of the one or more microLEDs are to create a beam of light to be received by a corresponding microphotodiode of the one or more microphotodiodes,
wherein the first integrated circuit chip is to send data to the second integrated circuit chip by modulation of the one or more microLEDs,
wherein the first integrated circuit chip is mounted on a top surface of the substrate,
wherein the second integrated circuit chip is mounted on the top surface the substrate,
wherein a channel is defined in the substrate extending from the first integrated circuit chip to the second integrated circuit chip,
wherein the beam of light of individual microLEDs of the one or more microLEDs is to travel through the channel from the first integrated circuit chip to the second integrated circuit chip.