US 12,436,291 B2
Sensor chip, electronic apparatus, and distance measurement apparatus
Akira Matsumoto, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/310,999
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Feb. 7, 2020, PCT No. PCT/JP2020/004788
§ 371(c)(1), (2) Date Sep. 3, 2021,
PCT Pub. No. WO2020/189082, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 2019-050885 (JP), filed on Mar. 19, 2019.
Prior Publication US 2022/0163674 A1, May 26, 2022
Int. Cl. G01S 17/93 (2020.01); G01S 7/481 (2006.01); G01S 17/931 (2020.01); H10F 30/225 (2025.01)
CPC G01S 17/931 (2020.01) [G01S 7/4816 (2013.01); H10F 30/225 (2025.01)] 16 Claims
OG exemplary drawing
 
1. A sensor chip, comprising:
a pixel including:
a photoelectric converter that includes:
a first surface through which light enters, wherein the first surface corresponds to a light entering surface; and
a multiplication region configured to cause avalanche multiplication of carriers in a high electric-field region of the pixel;
a light reflector opposite to the light entering surface; and
a light collector between the photoelectric converter and the light reflector, wherein
the light collector includes a diffractive lens,
the diffractive lens includes a plurality of first concave-convex sections,
the plurality of first concave-convex sections is concentric and periodic, and
each of the plurality of first concave-convex sections includes an electrically conductive film.