US 12,436,188 B2
LED chuck
Tomoki Nukanobu, Nirasaki (JP); Hiroyuki Nakayama, Nirasaki (JP); Shigeru Kasai, Nirasaki (JP); Yoshiyuki Morifuji, Nirasaki (JP); and Dai Kobayashi, Nirasaki (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 18/282,744
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
PCT Filed Mar. 16, 2022, PCT No. PCT/JP2022/011973
§ 371(c)(1), (2) Date Sep. 18, 2023,
PCT Pub. No. WO2022/209903, PCT Pub. Date Oct. 6, 2022.
Claims priority of application No. 2021-057160 (JP), filed on Mar. 30, 2021.
Prior Publication US 2024/0159825 A1, May 16, 2024
Int. Cl. G01R 31/311 (2006.01)
CPC G01R 31/311 (2013.01) 13 Claims
OG exemplary drawing
 
1. A light emitting diode (LED) chuck comprising:
a top plate on which an object to be inspected is mounted;
a LED array substrate disposed to face the object to be inspected, the LED array substrate including a plurality of LEDs for heating the object to be inspected that is mounted on the top plate;
a cooling plate disposed on a back side of the LED array substrate;
a LED control substrate disposed on a back side of the cooling plate and controlling the plurality of LEDs; and
a base plate disposed to surround the LED control substrate,
wherein a surface of the cooling plate facing the LED control substrate and a surface of the base plate facing the LED control substrate are formed of a magnetic material.