US 12,436,106 B2
Apparatus and method for inspecting semiconductor device
Hyunwoo Ryoo, Suwon-si (KR); Seulji Song, Suwon-si (KR); Minji Jeon, Suwon-si (KR); Hidong Kwak, Suwon-si (KR); and Jeongho Ahn, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 17, 2023, as Appl. No. 18/222,608.
Claims priority of application No. 10-2022-0113052 (KR), filed on Sep. 6, 2022; and application No. 10-2022-0149776 (KR), filed on Nov. 10, 2022.
Prior Publication US 2024/0077424 A1, Mar. 7, 2024
Int. Cl. G01N 21/65 (2006.01); G01J 3/02 (2006.01); G01J 3/44 (2006.01)
CPC G01N 21/65 (2013.01) [G01J 3/0216 (2013.01); G01J 3/4412 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor-device inspection apparatus comprising:
a stage configured to allow a measurement target to be placed thereon;
an actuator configured to move the stage in a vertical direction;
a detector configured to detect a plurality of Raman spectra from scattered light scattered away from the measurement target; and
a processor configured to generate a plurality of spectral images for a measurement variable by using the plurality of Raman spectra detected by the detector,
wherein the detector is further configured to detect the plurality of Raman spectra at different vertical levels of the measurement target,
wherein the processor is further configured to match the plurality of Raman spectra to an auxiliary parameter and match the auxiliary parameter to the measurement variable based on a relationship between the plurality of Raman spectra and the measurement variable being undetermined, and
wherein the processor is further configured to directly match the plurality of Raman spectra to the measurement variable based on the relationship between the plurality of Raman spectra and the measurement variable being determined.