US 12,436,054 B2
Waterproof pressure sensing device with improved reliability and performance
Alexander A. Ned, Kinnelon, NJ (US); Scott Goodman, Wayne, NJ (US); and Andrew Bemis, Upper Saddle River, NJ (US)
Assigned to KULITE SEMICONDUCTOR PRODUCTS, INC., Leonia, NJ (US)
Filed by KULITE SEMICONDUCTOR PRODUCTS, INC., Leonia, NJ (US)
Filed on Apr. 14, 2023, as Appl. No. 18/300,490.
Prior Publication US 2024/0344912 A1, Oct. 17, 2024
Int. Cl. G01L 9/06 (2006.01); G01L 19/06 (2006.01)
CPC G01L 19/0645 (2013.01) [G01L 9/06 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A pressure sensor device, comprising:
a non-corrosive housing;
a sensor chip comprising silicon and contact glass, the sensor chip configured for low-pressure measurements;
an electrically insulating and stress-absorbing spacer layer disposed between the non-corrosive housing and the contact glass of the sensor chip;
at least two electrical feedthrough pins;
electrical interconnections disposed between the sensor chip and the electrical feedthrough pins;
wherein a back end of the pressure sensor device is hermetically sealed; and
wherein only a backside of the sensor chip, the spacer layer, and the housing is exposed to pressure media during use.