US 12,436,051 B2
Sensor arrangement
Athanasios Kollias, Munich (DE); Marc Fueldner, Neubiberg (DE); Matthias Friedrich Herrmann, Munich (DE); Gunar Lorenz, Deisenhofen (DE); and Andreas Wiesbauer, Pörtschach a.W. (AT)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Dec. 7, 2022, as Appl. No. 18/062,886.
Claims priority of application No. 21213416 (EP), filed on Dec. 9, 2021.
Prior Publication US 2023/0184610 A1, Jun. 15, 2023
Int. Cl. G01L 9/00 (2006.01); H04R 7/06 (2006.01)
CPC G01L 9/0072 (2013.01) [H04R 7/06 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A sensor arrangement comprising:
a substrate having a through opening between a first and a second main surface region thereof;
a sound transducing portion arranged at the first main surface region of the substrate and at least partially spanning the through opening in the substrate;
wherein the sound transducing portion comprises a deflectable membrane structure and a counter electrode; and
a pressure sensing portion arranged at the first main surface region of the substrate and fluidically coupled to the through opening in the substrate,
wherein the pressure sensing portion comprises a first rigid electrode and second rigid electrode, and a deflectable membrane structure in a stacked configuration,
wherein the deflectable membrane structure of the pressure sensing portion is located opposite a plane of the first main surface region of the substrate,
wherein the first and second rigid electrodes of the pressure sensing portion form a reference capacitor of the pressure sensing portion, and wherein the second rigid electrode and the deflectable membrane structure of the pressure sensing portion form a sense capacitor of the pressure sensing portion in the stacked configuration.