US 12,436,025 B2
Multi-stage structure-borne sound and vibration sensor
Darin Krajewski, White Lake, MI (US); Yu Du, Chicago, IL (US); Péter Atilla Kardos, Budapest (HU); and Flórián Czinege, Budapest (HU)
Assigned to Harman International Industries, Incorporated, Stamford, CT (US)
Filed by Harman International Industries, Incorporated, Stamford, CT (US)
Filed on Jul. 28, 2023, as Appl. No. 18/227,533.
Application 18/227,533 is a continuation in part of application No. 17/332,492, filed on May 27, 2021, granted, now 11,743,656.
Prior Publication US 2023/0366727 A1, Nov. 16, 2023
Int. Cl. G01H 11/08 (2006.01)
CPC G01H 11/08 (2013.01) 16 Claims
OG exemplary drawing
 
1. A sound and vibration sensor comprising:
a housing;
a piezo-diaphragm including a substrate plate positioned in the housing to detect an input signal including audio or vibrations,
wherein the substrate plate and at least one first portion of the housing define a first volume of air positioned on a first side of the sensor,
wherein the substrate plate and at least one second portion of the housing define a second volume of air positioned on a second side of the sensor and the first volume of air and the second volume of air at least providing a differential pressure level on the piezo-diaphragm, and
wherein at least one of the housing and the substrate plate define at least one channel to ventilate the at least one of the first volume or air and the second volume of air to minimize or reduce the differential pressure level on the piezo-diaphragm; and
a flexible support plate to receive the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal,
wherein the flexible support plate includes a mounting post extending therefrom and being configured to receive the piezo-diaphragm to support the piezo-diaphragm in the housing.