US 12,436,006 B2
Sensor device and electronic apparatus
Masayasu Sakuma, Kamiina (JP); Yoshihiro Kobayashi, Komagane (JP); Shojiro Kitamura, Suwa (JP); and Taketo Chino, Hokuto (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on May 16, 2024, as Appl. No. 18/665,987.
Application 17/395,519 is a division of application No. 16/743,517, filed on Jan. 15, 2020, granted, now 11,215,484, issued on Jan. 4, 2022.
Application 16/135,510 is a division of application No. 14/596,853, filed on Jan. 14, 2015, granted, now 10,107,653, issued on Oct. 23, 2018.
Application 14/596,853 is a division of application No. 13/545,075, filed on Jul. 10, 2012, granted, now 8,960,000, issued on Feb. 24, 2015.
Application 18/665,987 is a continuation of application No. 18/307,274, filed on Apr. 26, 2023, granted, now 12,031,847.
Application 18/307,274 is a continuation of application No. 17/395,519, filed on Aug. 6, 2021, granted, now 11,709,079, issued on Jul. 25, 2023.
Application 16/743,517 is a continuation of application No. 16/135,510, filed on Sep. 19, 2018, granted, now 10,612,948, issued on Apr. 7, 2020.
Claims priority of application No. 2011-154502 (JP), filed on Jul. 13, 2011.
Prior Publication US 2024/0302191 A1, Sep. 12, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01D 11/24 (2006.01); G01C 19/5769 (2012.01); G01C 21/16 (2006.01); H01R 12/72 (2011.01); H05K 1/14 (2006.01); G01D 11/30 (2006.01)
CPC G01D 11/245 (2013.01) [G01C 19/5769 (2013.01); G01C 21/166 (2020.08); H01R 12/72 (2013.01); H05K 1/148 (2013.01); G01D 11/30 (2013.01); H05K 2201/09163 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A sensor device comprising:
a first rigid board having a first mounting surface and a first side, the first side being configured with a first protrusion and a base, the base linearly extending along a first direction, the first protrusion outwardly protruding along a second direction from a first extending linear line, the base being located directly adjacent to the first protrusion along the first direction, the second direction being perpendicular to the first direction;
a first sensor mounted on the first mounting surface;
a second rigid board having a second mounting surface;
a second sensor mounted on the second mounting surface;
a first flexible board connecting the second rigid board and a part of the first side of the first rigid board; and
a casing housing the first rigid board, the second rigid board, and the first flexible board with the first flexible board bent,
wherein an entirety of the first protrusion does not overlap the first flexible board when viewed along a normal direction with respect to the first mounting surface of the first rigid board and along the second direction.