| CPC F24F 5/0042 (2013.01) [E04B 1/762 (2013.01); E04B 1/7654 (2013.01); F24F 5/0089 (2013.01); H02S 20/26 (2014.12); H10N 10/17 (2023.02)] | 15 Claims |

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1. An architectural structure, comprising:
a wall of a room of the architectural structure; and a panel integrated into the wall, wherein the panel comprises thermoelectric components (TECs) arranged as a TEC grid, thereby defining a radiant panel,
wherein: the TECs, of the TEC grid, are thermally coupled to a common heat sink formed in part by an exterior surface of the wall; and the wall defines a wall surface area, the panel defines a panel surface area, and the panel surface area is between 5% and 20% of the wall surface area,
wherein the wall defines a panel aperture, and the panel is disposed within the panel aperture, wherein the wall defines a wall interior surface and a wall exterior surface that are depthwise spaced apart from each other, wherein the panel defines a panel exterior surface and a panel interior surface that are depthwise spaced apart from each other,
wherein: the wall exterior and interior surfaces and the panel exterior and interior surfaces are parallel to each other; and the panel exterior surface is flush with, or continuous with, the wall exterior surface to define the common heat sink for the TEC grid, and
wherein:
a panel depth of the panel is greater than a wall depth of the wall so that the panel interior surface is depthwise spaced apart from the wall interior surface.
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