US 12,435,506 B2
Safer dustless method for installing a precompressed expansion joint sealing system
Lester Hensley, Westborough, MA (US); Massimo Demarco, Woodbridge (CA); and Eric Muench, Fanwood, NJ (US)
Assigned to SIKA TECHNOLOGY AG, Baar (CH)
Appl. No. 18/036,921
Filed by SIKA TECHNOLOGY AG, Baar (CH)
PCT Filed Jan. 14, 2022, PCT No. PCT/EP2022/050812
§ 371(c)(1), (2) Date May 15, 2023,
PCT Pub. No. WO2022/157086, PCT Pub. Date Jul. 28, 2022.
Claims priority of provisional application 63/140,428, filed on Jan. 22, 2021.
Prior Publication US 2023/0417047 A1, Dec. 28, 2023
Int. Cl. E04B 1/68 (2006.01)
CPC E04B 1/6812 (2013.01) 8 Claims
OG exemplary drawing
 
1. A safer, dustless method for installing a precompressed expansion joint sealing system, the method comprising:
locating a first substrate and a second substrate, the second substrate arranged coplanar with the first substrate and being spaced therefrom by a gap formed between opposing surfaces of the first substrate and the second substrate;
preparing the opposing surfaces of the first substrate and the second substrate without mechanically grinding, abrading or scraping by wiping the opposing surfaces with a solvent leaving any surface deformations and residue;
applying a mounting band of a liquid sealant to the opposing surfaces of the first substrate and the second substrate;
disposing a precompressed expansion joint sealing system in the gap by locating the expansion joint sealing system in a position between the opposing surfaces and at least in one of proximity to or within the mounting band of the liquid sealant applied to the opposing surfaces of the first substrate and the second substrate; and
maintaining the precompressed expansion joint sealing system in the position in the gap until the precompressed expansion joint sealing system expands outwardly toward the opposing surfaces, embeds within the mounting band of sealant and secures the expansion joint sealing system in the position between opposing surfaces of the first substrate and the second substrate.