US 12,435,426 B2
Substrate liquid processing apparatus and substrate liquid processing method
Mitsuaki Iwashita, Nirasaki (JP); and Takeshi Nagao, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Appl. No. 17/754,573
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Sep. 28, 2020, PCT No. PCT/JP2020/036604
§ 371(c)(1), (2) Date Apr. 6, 2022,
PCT Pub. No. WO2021/070659, PCT Pub. Date Apr. 15, 2021.
Claims priority of application No. 2019-186239 (JP), filed on Oct. 9, 2019.
Prior Publication US 2024/0060186 A1, Feb. 22, 2024
Int. Cl. C23C 18/16 (2006.01)
CPC C23C 18/1628 (2013.01) [C23C 18/1619 (2013.01); C23C 18/1633 (2013.01); C23C 18/1676 (2013.01); C23C 18/168 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate liquid processing apparatus, comprising:
a substrate holder configured to hold a substrate;
a reaction acceleration unit, configured to accelerate a plating reaction of an unused electroless plating solution, including an activation unit configured to accelerate the electroless plating solution with respect to the plating reaction and a reaction heater configured to heat the electroless plating solution; and
a plating solution supply configured to supply the electroless plating solution to the substrate held by the substrate holder,
wherein the activation unit has a catalyst contact unit configured to activate the electroless plating solution with respect to the plating reaction by bringing a catalyst member into contact with the electroless plating solution.