US 12,435,410 B2
Substrate processing system and substrate processing method
Koji Maeda, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/631,855
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
PCT Filed Jul. 2, 2020, PCT No. PCT/JP2020/026069
§ 371(c)(1), (2) Date Jan. 31, 2022,
PCT Pub. No. WO2021/024659, PCT Pub. Date Feb. 11, 2021.
Claims priority of application No. 2019-146683 (JP), filed on Aug. 8, 2019.
Prior Publication US 2022/0319819 A1, Oct. 6, 2022
Int. Cl. C23C 14/56 (2006.01); C23C 14/06 (2006.01); C23C 14/35 (2006.01); C23C 14/50 (2006.01); G11B 5/85 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC C23C 14/568 (2013.01) [C23C 14/06 (2013.01); C23C 14/351 (2013.01); C23C 14/50 (2013.01); G11B 5/85 (2013.01); H01J 37/32733 (2013.01); H01J 37/32743 (2013.01); H01J 37/32899 (2013.01); H01J 37/3452 (2013.01); H01L 21/67184 (2013.01); H01L 21/67742 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate processing system comprising:
a plurality of transfer modules having transfer mechanisms configured to transfer substrates; and
a plurality of process modules connected to the plurality of transfer modules,
wherein at least one of the plurality of process modules is a film forming
apparatus for performing sputtering film formation on a substrate,
wherein the at least one of the plurality of process modules performs the sputtering film formation of a magnetic film by sputtering plasma to a magnetic target while applying a magnetic field using a ring magnet disposed around the substrate,
wherein the transfer mechanisms of the plurality of transfer modules transfer a plurality of substrates sequentially and serially to the plurality of process modules, and
each of the plurality of transfer modules has an aligner contained within the transfer module that is configured to align a substrate when transferring the substrate to one of the plurality of process modules,
wherein, in each of the transfer modules, the aligner that is contained within the transfer module is disposed on a transfer path of the transfer mechanism when transferring the substrate to a substrate holder of one of the plurality of process modules and the aligner is disposed on a straight line that connects a rotation center of the transfer mechanism and a center of the substrate holder of one of the plurality of process modules,
wherein the aligner is configured to detect a position of a notch of the substrate based on light emitted by a light emitting device being received by a light receiving device, and a direction of the magnetic field of the ring magnet and an angle of the notch formed at the substrate are adjusted to a predetermined angle in the at least one of the plurality of process modules based on a detected notch position.