| CPC C09J 7/38 (2018.01) [H01L 21/568 (2013.01); H01L 23/293 (2013.01); H01L 23/3107 (2013.01); H01L 23/49506 (2013.01); C09J 2203/326 (2013.01); C09J 2301/502 (2020.08); H01L 24/46 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/186 (2013.01)] | 8 Claims |

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1. A temporary protective film for semiconductor encapsulation molding, comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film, wherein
the adhesive layer comprises
a thermoplastic resin, and
at least one compound selected from the group consisting of sorbitol polyglycidyl ether, polyethylene glycol diglycidyl ether, a glycidyl ether of an aliphatic alcohol having 10 to 20 carbon atoms, glycerol polyglycidyl ether, a polyalkylene glycol ester of a fatty acid having 2 to 30 carbon atoms, a dipentaerythritol ester of a fatty acid having 2 to 20 carbon atoms, polyethylene glycol monoalkyl ether, and polyethylene glycol dialkyl ether, and
wherein the thermoplastic resin comprises at least one selected from the group consisting of an aromatic polyether amideimide, an aromatic polyether imide, an aromatic polyether amide, an aromatic polyamide, an aromatic polyester, an aromatic polyimide, an aromatic polyamideimide, an aromatic polyether, and an aromatic polyester imide.
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