US 12,434,467 B2
Method and apparatus for substrate and spacer separation
Kok Kiong Chai, Sarawak (MY); Siew Fu Chai, Sarawak (MY); and Samg Yin Tang, Sarawak (MY)
Assigned to Western Digital Technologies, Inc., San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Jul. 31, 2023, as Appl. No. 18/228,080.
Claims priority of provisional application 63/523,801, filed on Jun. 28, 2023.
Prior Publication US 2025/0001752 A1, Jan. 2, 2025
Int. Cl. B32B 43/00 (2006.01); B32B 38/18 (2006.01)
CPC B32B 43/006 (2013.01) [B32B 2038/1891 (2013.01); B32B 2309/66 (2013.01); B32B 2429/02 (2013.01); Y10T 156/1174 (2015.01); Y10T 156/1189 (2015.01); Y10T 156/195 (2015.01); Y10T 156/1972 (2015.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for separating components of a laminate of disk-shaped substrates interleaved with disk-shaped spacers, the apparatus comprising:
a pusher bar configured to push against a first end of the laminate to push a second end of the laminate against a roller;
wherein the roller is configured to rotate while pressing against a flat surface of a substrate at the second end of the laminate to remove the substrate from the second end of the laminate to expose a spacer of the laminate and to then rotate while pressing against a flat surface of the spacer to remove the spacer from the laminate to expose another substrate of the laminate; and
a controller configured to control the roller and the pusher bar to sequentially remove the substrate, the spacer, and additional substrates and spacers from the laminate.