US 12,434,465 B2
RF tag laminate manufacturing method and RF tag laminate
Nobuyuki Onizuka, Tokyo (JP)
Assigned to BRIDGESTONE CORPORATION, Tokyo (JP)
Appl. No. 18/550,778
Filed by BRIDGESTONE CORPORATION, Tokyo (JP)
PCT Filed Nov. 24, 2021, PCT No. PCT/JP2021/043056
§ 371(c)(1), (2) Date Sep. 15, 2023,
PCT Pub. No. WO2023/276189, PCT Pub. Date Jan. 5, 2023.
Claims priority of application No. 2021-109730 (JP), filed on Jun. 30, 2021.
Prior Publication US 2024/0169177 A1, May 23, 2024
Int. Cl. B32B 37/00 (2006.01); B32B 3/18 (2006.01); B32B 25/04 (2006.01); B32B 37/10 (2006.01); B32B 37/20 (2006.01); B32B 38/00 (2006.01); G06K 19/07 (2006.01)
CPC B32B 37/003 (2013.01) [B32B 3/18 (2013.01); B32B 25/042 (2013.01); B32B 37/10 (2013.01); B32B 37/20 (2013.01); B32B 38/0004 (2013.01); G06K 19/0723 (2013.01); B32B 2319/00 (2013.01); B32B 2457/00 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of manufacturing radio frequency (RF) tag laminates that each includes: an RF tag that has an integrated circuit (IC) chip with a rectangular shape in a plan view, and an antenna connected to at least one of short sides of the rectangular shape of the IC chip; and coating rubber that is stacked on the RF tag so as to coat an outer surface of the RF tag, the method comprising:
an RF tag arranging step of arranging a plurality of RF tags on a first rubber sheet layer, which is to form part of the coating rubber;
a second rubber sheet layer stacking step, performed after the RF tag arranging step, of stacking a second rubber sheet layer, which is to form another part of the coating rubber, on the first rubber sheet layer and the plurality of RF tags; and
a roller pressure-bonding step, performed after the second rubber sheet layer stacking step, of pressure-bonding the first rubber sheet layer, the plurality of RF tags, and the second rubber sheet layer to each other using a first roller configured to move on, and relative to, the first rubber sheet layer, the plurality of RF tags, and the second rubber sheet layer, wherein
in the RF tag arranging step, the plurality of RF tags are arranged on the first rubber sheet layer in a manner such that long sides of the rectangular shape of the IC chip of each RF tag in the plurality of RF tags are inclined with respect to a direction orthogonal to a relative movement direction of the first roller in the plan view,
the RF tag arranging step further comprises arranging the plurality of RF tags side-by-side such that long sides of the IC chips of adjacent RF tags of the plurality of RF tags face each other and such that the plurality of RF tags are spaced apart from each other by an empty gap without overlapping in the relative movement direction of the first roller, and
in the roller pressure-bonding step, the first roller moves on, and relative to, the first rubber sheet layer, the plurality of RF tags, and the second rubber sheet layer in a direction intersecting the long sides of the IC chips.