US 12,434,456 B2
Laminated member
Yu Hanawa, Tokyo (JP); Shuhei Ogawa, Tokyo (JP); Seiji Inaba, Tokyo (JP); and Hiroyuki Yamamoto, Tokyo (JP)
Assigned to AGC Inc., Tokyo (JP)
Filed by AGC Inc., Tokyo (JP)
Filed on Dec. 8, 2022, as Appl. No. 18/063,138.
Application 18/063,138 is a continuation of application No. PCT/JP2021/021106, filed on Jun. 2, 2021.
Claims priority of application No. 2020-101051 (JP), filed on Jun. 10, 2020; application No. 2020-161312 (JP), filed on Sep. 25, 2020; and application No. 2021-007287 (JP), filed on Jan. 20, 2021.
Prior Publication US 2023/0107722 A1, Apr. 6, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 17/06 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 17/10 (2006.01); B32B 18/00 (2006.01); B32B 37/12 (2006.01); B32B 37/20 (2006.01); C04B 35/565 (2006.01)
CPC B32B 17/06 (2013.01) [B32B 7/12 (2013.01); B32B 18/00 (2013.01); B32B 37/12 (2013.01); B32B 37/20 (2013.01); B32B 2250/03 (2013.01); B32B 2307/302 (2013.01); B32B 2307/308 (2013.01); B32B 2307/412 (2013.01); B32B 2315/02 (2013.01); B32B 2315/08 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A laminated member, comprising:
a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more and a thickness in a range of 3 mm to 40 mm;
a bonding layer comprising a resin and formed on the glass member; and
a Si—SiC member formed on the bonding layer and having a thickness in a range of 0.5 to 15mm, such that the Si—SiC member has an average linear expansion coefficient α at 20 to 200° C. of 2.85 to 4.00 ppm/° C.