US 12,434,347 B2
Method for CMP temperature control
Haosheng Wu, San Jose, CA (US); Shou-Sung Chang, Mountain View, CA (US); Chih Chung Chou, San Jose, CA (US); Jianshe Tang, San Jose, CA (US); Hui Chen, San Jose, CA (US); Hari Soundararajan, Sunnyvale, CA (US); and Brian J. Brown, Palo Alto, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Dec. 12, 2023, as Appl. No. 18/537,574.
Application 18/537,574 is a division of application No. 16/989,734, filed on Aug. 10, 2020.
Claims priority of provisional application 62/886,260, filed on Aug. 13, 2019.
Prior Publication US 2024/0109163 A1, Apr. 4, 2024
Int. Cl. B24B 37/015 (2012.01); B24B 57/02 (2006.01); H01L 21/321 (2006.01); H01L 21/67 (2006.01)
CPC B24B 37/015 (2013.01) [B24B 57/02 (2013.01); H01L 21/3212 (2013.01); H01L 21/67248 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method of temperature control for a chemical mechanical polishing system, comprising:
delivering a gas from a gas source to a convergent-divergent nozzle, wherein the gas is formed by evaporation of liquid ethanol, by evaporation of liquid isopropyl alcohol, or by sublimation of dry ice;
cooling the gas from an initial temperature above 20° C. to below 0° C. by flowing the gas through the convergent-divergent nozzle;
injecting a liquid through a sidewall of and into a throat of the convergent-divergent nozzle; and
directing the cooled gas and liquid onto a polishing pad.