US 12,434,341 B2
Electrostatic chuck apparatus
Yoshiaki Moriya, Kanagawa (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 24, 2023, as Appl. No. 18/126,017.
Claims priority of application No. 2022-070533 (JP), filed on Apr. 22, 2022; and application No. 10-2022-0156763 (KR), filed on Nov. 21, 2022.
Prior Publication US 2023/0339059 A1, Oct. 26, 2023
Int. Cl. B23Q 11/14 (2006.01); B23Q 3/154 (2006.01); B23Q 11/12 (2006.01); H01L 21/683 (2006.01)
CPC B23Q 11/143 (2013.01) [B23Q 3/154 (2013.01); B23Q 11/128 (2013.01); H01L 21/6833 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electrostatic chuck apparatus comprising:
a base comprising a cooling flow path, the cooling flow path configured to have a refrigerant flow therethrough;
an adiabatic layer on the base;
a uniform heating plate on the adiabatic layer;
a heating element between the adiabatic layer and the uniform heating plate;
an insulating layer on the uniform heating plate, the insulating layer comprising a ceramic;
a conductive layer on the insulating layer, the conductive layer having an area smaller than an area of the insulating layer; and
a dielectric layer on the conductive layer, the dielectric layer comprising a ceramic,
wherein the uniform heating plate has a uniform thickness and comprises a material having different thermal conductivity in a vertical direction and a horizontal direction with respect to a thickness direction of the heating element.