US 12,434,316 B2
Soldering apparatus
Yasuji Kawashima, Osaka (JP); Hiroshi Taguchi, Tokyo (JP); Kyoko Kuramoto, Tokyo (JP); Henri Hanzawa, Tokyo (JP); Tomotake Kagaya, Tokyo (JP); and Katsuhiro Shinohara, Tokyo (JP)
Assigned to SENJU METAL INDUSTRY CO., LTD., Tokyo (JP)
Appl. No. 18/874,560
Filed by SENJU METAL INDUSTRY CO., LTD., Tokyo (JP)
PCT Filed Jun. 12, 2023, PCT No. PCT/JP2023/021650
§ 371(c)(1), (2) Date Dec. 12, 2024,
PCT Pub. No. WO2023/243576, PCT Pub. Date Dec. 21, 2023.
Claims priority of application No. 2022-094829 (JP), filed on Jun. 13, 2022.
Prior Publication US 2025/0162053 A1, May 22, 2025
Int. Cl. B23K 3/08 (2006.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01)
CPC B23K 3/08 (2013.01) [B08B 1/12 (2024.01); B08B 1/20 (2024.01)] 5 Claims
OG exemplary drawing
 
1. A soldering apparatus comprising:
a conveyance unit having conveyance claws for gripping and conveying a substrate, the conveyance claws moving along a conveyance rail;
a supply unit for supplying molten solder to the substrate being conveyed by the conveyance claws of the conveyance unit; and
a solder removing mechanism for removing solder from the conveyance claws after conveying the substrate soldered with the molten solder supplied from the supply unit,
wherein the solder removing mechanism comprises an abutment plate that is configured to relatively pass through recesses of the conveyance claws or below the conveyance claws,
wherein the abutment plate comprises a base end part, a distal end part that extends downstream in a direction of movement of the conveyance claws along the conveyance rail, and a bent part between the base end and the distal end part, and
wherein the distal end part is located downstream of the bent part in the direction of movement of the conveyance claws along the conveyance rail and the distal end part extends downstream in the direction of movement of the conveyance claws.