US 12,434,263 B2
Metal coated resin particles, method for producing same, conductive paste containing metal coated resin particles, and conductive film
Kensuke Kageyama, Akita (JP); Kei Kinoshita, Akita (JP); and Osamu Sakaya, Akita (JP)
Assigned to Mitsubishi Materials Electronic Chemicals Co., Ltd., Akita (JP)
Appl. No. 17/924,019
Filed by Mitsubishi Materials Electronic Chemicals Co., Ltd., Akita (JP)
PCT Filed Jun. 24, 2021, PCT No. PCT/JP2021/023899
§ 371(c)(1), (2) Date Nov. 8, 2022,
PCT Pub. No. WO2022/004541, PCT Pub. Date Jan. 6, 2022.
Claims priority of application No. 2020-115826 (JP), filed on Jul. 3, 2020.
Prior Publication US 2023/0173537 A1, Jun. 8, 2023
Int. Cl. B05D 1/30 (2006.01); B05D 1/38 (2006.01)
CPC B05D 1/38 (2013.01) [B05D 1/30 (2013.01); B05D 2201/02 (2013.01)] 10 Claims
OG exemplary drawing
 
1. Metal coated resin particles comprising:
spherical core resin particles; and
a metal coated layer provided on a surface of each of the core resin particles,
wherein the metal coated layer consists of: a first silver layer formed on the surface of each of the core resin particles; a tin intermediate layer consisting of one or more of metallic tin and/or tin compounds selected from the group consisting of tin (Sn), tin oxide (SnxOy), and tin hydroxide (Snx(OH)y) formed on a surface of the first silver layer (where, 0.1<x<4, 0.1<y<5); and a second silver layer formed on a surface of the tin intermediate layer.