US 12,434,237 B2
Temperature control system, detection system and temperature control method for micro-fluidic chip
Yongjia Gao, Beijing (CN); Yingying Zhao, Beijing (CN); Hui Liao, Beijing (CN); Wenliang Yao, Beijing (CN); Le Gu, Beijing (CN); Bolin Fan, Beijing (CN); and Yue Li, Beijing (CN)
Assigned to Beijing BOE Sensor Technology Co., Ltd., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/600,090
Filed by Beijing BOE Sensor Technology Co., Ltd., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Feb. 26, 2021, PCT No. PCT/CN2021/078127
§ 371(c)(1), (2) Date Sep. 29, 2021,
PCT Pub. No. WO2021/175163, PCT Pub. Date Sep. 10, 2021.
Claims priority of application No. 202010136822.8 (CN), filed on Mar. 2, 2020.
Prior Publication US 2022/0193669 A1, Jun. 23, 2022
Int. Cl. B01L 3/00 (2006.01); G05D 23/19 (2006.01); G05D 23/24 (2006.01)
CPC B01L 3/502715 (2013.01) [G05D 23/1928 (2013.01); G05D 23/24 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/1811 (2013.01); B01L 2300/1894 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A temperature control system for a micro-fluidic chip, comprising:
a circuit structure in a functional layer of the micro-fluidic chip, corresponding to a reaction zone of the micro-fluidic chip, and comprising a plurality of thermistors and a plurality of ports, wherein the plurality of ports comprises input ports and output ports, and the input ports are electrically coupled to the output ports are electrically through at least one of the plurality of thermistors to form application circuits, respectively; and
a controller electrically coupled to each of the plurality of ports and configured to select a first input port and a first output port among the plurality of ports, such that the circuit structure is configured to form a first application circuit as a heating device, and to select a second input port and a second output port among the plurality of ports, such that the circuit structure is configured to form a second application circuit as a temperature sensor,
wherein the first application circuit; comprises the first input port, the first output port and a first number of thermistors among the plurality of thermistors electrically coupled between the first input port and the first output port, and the second application circuit comprises, the second input port, the second output port, and a second number of thermistors among the plurality of thermistors electrically coupled between the second input port and the second output port,
wherein the controller is further configured to:
obtain a current temperature of the reaction zone, in response to the circuit structure being configured to form the second application circuit as the temperature sensor; and
select the first input port and the first output port, in a case where the current temperature is lower than a first preset temperature, such that the circuit structure is configured to form the first application circuit as the heating device to heat the reaction zone until a temperature of the reaction zone reaches the first preset temperature.