US 12,433,394 B2
Wafer cleaning brush
Jeong Hye Yoon, Seoul (KR); Sung Taek Kim, Seoul (KR); and Chi Hyung Kim, Seoul (KR)
Assigned to Yunslab Co., Ltd., Siheung-si (KR)
Filed by Yunslab Co., Ltd., Siheung-si (KR)
Filed on Dec. 20, 2023, as Appl. No. 18/391,532.
Application 18/391,532 is a continuation of application No. PCT/KR2023/010090, filed on Jul. 14, 2023.
Claims priority of application No. 10-2023-0076578 (KR), filed on Jun. 15, 2023.
Prior Publication US 2024/0415274 A1, Dec. 19, 2024
Int. Cl. A46B 11/06 (2006.01); A46B 9/02 (2006.01)
CPC A46B 11/06 (2013.01) [A46B 9/025 (2013.01); A46B 9/026 (2013.01); A46B 2200/3073 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A wafer cleaning brush comprising:
a brush including a hollow formed inside the brush and through which a cleaning liquid is discharged, and a plurality of protrusions formed on an outer surface of the brush; and
a film surrounding the outer surface of the brush,
wherein the film includes a plurality of holes through which the protrusions pass,
wherein a guide having a shape that protrudes inward than other regions is disposed on an inner surface of the film, which faces the outer surface of the brush.