| CPC A43B 17/107 (2013.01) [A43B 17/006 (2013.01); A43D 8/02 (2013.01); A43D 25/181 (2013.01); B29C 65/4815 (2013.01); B29D 35/142 (2013.01); B32B 5/245 (2013.01); B32B 7/14 (2013.01); B32B 37/0053 (2013.01); B32B 37/0076 (2013.01); B32B 37/1292 (2013.01); C08K 3/36 (2013.01); C08K 9/04 (2013.01); B29L 2031/507 (2013.01); B32B 2037/1215 (2013.01); B32B 2264/1021 (2020.08); B32B 2305/022 (2013.01); B32B 2305/18 (2013.01); B32B 2437/02 (2013.01); C08K 2201/011 (2013.01)] | 7 Claims |

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1. A method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, the method comprising:
melting adhesive resin, the adhesive resin comprising a resin selected from the group consisting of thermoplastic polyurethane (TPU) and ethylene vinyl acetate (EVA), the adhesive resin further comprising hydrophobic nano-silica in a range of 0.2 to 5 phr;
applying the adhesive resin to a surface of a transfer roller in which an intaglio dot pattern is formed in a shoe insole shape such that the adhesive resin is applied to the surface of the transfer roller with the intaglio dot pattern;
removing adhesive resin applied to an area which is not part of the intaglio dot pattern using a scraper;
transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of a foam or a fabric, thereby forming a dot pattern adhesive resin layer on a surface of the foam or the fabric;
bonding the foam and the fabric by compressing; and
cutting the bonded foam and fabric formed by the bonding step out in the shoe insole shape, thereby forming the dot bonding shoe insole,
wherein the hydrophobic nano-silica forms aggregates of the hydrophobic nano-silica having an average nano-silica aggregation size of about 100 to about 1200 nm in the dot pattern adhesive resin layer on the surface of the foam or the fabric.
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