US 12,433,336 B2
Atomizing assembly and electronic atomizing device
Hongliang Luo, Shenzhen (CN); Lingrong Xiao, Shenzhen (CN); Xiaoping Li, Shenzhen (CN); Congwen Xiao, Shenzhen (CN); and Xuebo Xue, Shenzhen (CN)
Assigned to SHENZHEN SMOORE TECHNOLOGY LIMITED, Shenzhen (CN)
Appl. No. 17/628,826
Filed by SHENZHEN SMOORE TECHNOLOGY LIMITED, Shenzhen (CN)
PCT Filed Jul. 23, 2020, PCT No. PCT/CN2020/103663
§ 371(c)(1), (2) Date Jan. 20, 2022,
PCT Pub. No. WO2021/013208, PCT Pub. Date Jan. 28, 2021.
Claims priority of application No. 201910665778.7 (CN), filed on Jul. 23, 2019.
Prior Publication US 2022/0256924 A1, Aug. 18, 2022
Int. Cl. A24F 47/00 (2020.01); A24F 40/10 (2020.01); A24F 40/44 (2020.01); A24F 40/46 (2020.01); H05B 3/06 (2006.01)
CPC A24F 40/46 (2020.01) [A24F 40/10 (2020.01); A24F 40/44 (2020.01); H05B 3/06 (2013.01); H05B 2203/021 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An atomizing assembly, comprising:
a base body comprising an atomizing surface configured to atomize liquid into smoke;
a heating element configured to be connected to a power source to heat the atomizing surface, the heating element being directly or indirectly disposed on the atomizing surface, and an area of a projection of the heating element on the atomizing surface being less than an area of the atomizing surface, such that the atomizing surface is divided into a heating region occupied by the projection of the heating element and a blank region surrounding the heating region; and
a heat conductor at least partially disposed in the blank region of the atomizing surface and connected to the heating element,
wherein the heat conductor is a porous ceramic film, porous carbon or a porous metal film,
wherein a thermal conductivity of the heat conductor is higher than a thermal conductivity of the base body;
wherein both the heating element and the heat conductor are directly attached to the atomizing surface;
wherein the heat conductor comprises a plurality of heat conduction units discretely arranged, one end of the heat conduction unit is connected to the heating element, and the other end of the heat conduction unit is a free end and located in a blank region of the atomizing surface.