US 12,433,187 B2
Systems and methods for monitoring seed placement within the ground
Trevor Stanhope, Oak Lawn, IL (US); Jamil Farhat, Spicer, MN (US); and James W. Henry, Saskatoon (CA)
Assigned to CNH Industrial Canada, Ltd., Saskatoon (CA)
Filed by CNH Industrial Canada, Ltd., Saskatoon (CA)
Filed on Mar. 21, 2022, as Appl. No. 17/699,912.
Prior Publication US 2023/0292650 A1, Sep. 21, 2023
Int. Cl. A01C 7/10 (2006.01); A01C 5/06 (2006.01); G01S 13/88 (2006.01)
CPC A01C 7/105 (2013.01) [G01S 13/885 (2013.01); A01C 5/064 (2013.01); A01C 5/068 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A system for monitoring seed placement within the ground during the performance of a planting operation, the system comprising:
a row unit configured to deposit seeds within soil, the row unit including a furrow opening assembly configured to create a furrow in the soil for depositing seeds and a furrow closing assembly configured to close the furrow after the seeds have been deposited therein, the seeds being coated seeds that are coated with a coating having a coating dielectric property that is greater than a dielectric property of the seeds without the coating;
a seed placement sensor supported relative to the row unit and being configured to generate data indicative of the coated seeds as planted underneath a surface of the soil post-closing of the furrow; and
a computing system communicatively coupled to the seed placement sensor, the computing system being configured to:
receive the data generated by the seed placement sensor; and
determine a seed placement parameter associated with the coated seeds underneath the surface of the soil post-closing of the furrow based at least in part on the data generated by the seed placement sensor.