US 12,108,690 B2
Quantum device
Katsumi Kikuchi, Tokyo (JP); Akira Miyata, Tokyo (JP); Suguru Watanabe, Tokyo (JP); Takanori Nishi, Tokyo (JP); Hideyuki Satou, Tokyo (JP); Kenji Nanba, Tokyo (JP); and Ayami Yamaguchi, Tokyo (JP)
Assigned to NEC CORPORATION, Tokyo (JP)
Filed by NEC Corporation, Tokyo (JP)
Filed on Jun. 15, 2021, as Appl. No. 17/347,784.
Claims priority of application No. 2020-106148 (JP), filed on Jun. 19, 2020.
Prior Publication US 2021/0399196 A1, Dec. 23, 2021
Int. Cl. H01L 39/04 (2006.01); H01R 12/71 (2011.01); H10N 60/81 (2023.01); H01R 13/24 (2006.01)
CPC H10N 60/815 (2023.02) [H01R 12/714 (2013.01); H01R 13/24 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A quantum device comprising:
a quantum chip;
an interposer on which the quantum chip is mounted; and
a socket disposed so as to be opposed to the interposer, the socket comprising a movable pin and a housing supporting the movable pin, wherein
at least one end of the movable pin, which includes the one end and another end opposite to the one end, is movable relative to the housing, the one end being in electrical contact with a terminal of the interposer,
the other end is in electrical contact with a terminal of a board on which a connector is formed, the connector being configured to serve as an external input/output,
the interposer comprises a mounting surface on which the quantum chip is mounted, and an opposite surface opposite to the mounting surface, and
the socket is disposed so as to be opposed to the opposite surface.