US 12,108,577 B2
Self-aligning heat fins for thermal management
Uthayarajan A/L Rasalingam, Nibong Tebal (MY); and Vijay A/L Mohanarao, Sungai Petani (MY)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on May 12, 2022, as Appl. No. 17/743,184.
Prior Publication US 2023/0371209 A1, Nov. 16, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20509 (2013.01) [H05K 7/20 (2013.01); H05K 7/20009 (2013.01); H05K 7/20418 (2013.01); H05K 7/205 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A thermal dissipation device, comprising:
an enclosure;
a heat conductive plate attached to a surface of the enclosure and configured to thermally couple to one or more packaged components on a first side of the heat conductive plate; and
a heat conductive post coupled to a second side of the heat conductive plate and extending through the surface of and into the enclosure, wherein the heat conductive post includes:
a fin member rotatably coupled to the heat conductive post, wherein the fin member is configured to rotate about an axis of the heat conductive post to maximize a flow of air across the fin member and increase thermal dissipation of heat from the heat conductive plate into the atmosphere.