US 12,108,569 B2
Heat dissipation connection structure of handheld device
Ching-Hang Shen, New Taipei (TW)
Assigned to ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)
Filed by ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)
Filed on May 6, 2020, as Appl. No. 16/867,567.
Prior Publication US 2021/0352827 A1, Nov. 11, 2021
Int. Cl. H05K 7/20 (2006.01); F28F 21/08 (2006.01)
CPC H05K 7/20336 (2013.01) [F28F 21/081 (2013.01); F28F 21/083 (2013.01); F28F 21/085 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A heat dissipation connection structure of handheld device, comprising:
a middle frame main body defining an aperture with an inner periphery, the middle frame main body surrounding the aperture, the inner periphery having a channel section; and
a two-phase flow heat exchange unit being a vapor chamber with a lip section at an outer periphery of the vapor chamber, wherein an injection molding structure member encloses the lip section a periphery of the two-phase flow heat exchange unit, and wherein both the injection molding structure member and the lip section of the two-phase flow heat exchange unit are in the channel section of the middle frame main body, such that the two-phase flow heat exchange unit can be bonded to the middle frame main body and that the two-phase flow heat exchange unit can support an electronic componence and conduct heat from the electronic component.