US 12,108,539 B2
Four dimensional printed circuit boards
Jonathan D. Yuen, Washington, DC (US); Joyce C. Breger, Greenbelt, MD (US); and David A. Stenger, Annapolis, MD (US)
Assigned to The Government of the United States of America, as represented by the Secretary of the Navy, Arlington, VA (US)
Filed by The Government of the United States of America, as represented by the Secretary of the Navy, Arlington, VA (US)
Filed on May 6, 2022, as Appl. No. 17/738,122.
Claims priority of provisional application 63/186,832, filed on May 11, 2021.
Prior Publication US 2022/0369470 A1, Nov. 17, 2022
Int. Cl. C08L 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/12 (2006.01); H05K 3/18 (2006.01)
CPC H05K 3/125 (2013.01) [C08L 1/02 (2013.01); H05K 1/0393 (2013.01); H05K 1/118 (2013.01); H05K 3/181 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A four-dimensional (4D) printed circuit board (PCB), comprising:
a nanocellulose sheet;
an electrical circuit attached to the sheet; and
a pattern of cured SU-8 on the sheet, wherein stress induced by the cured SU-8 is sufficient to cause folding of the nanocellulose sheet.